Semiconductor process engineering — Windows desktop calculator and Claude-powered web agent.
Desktop app — four real-time panels
- Lithography: Rayleigh resolution and depth of focus curves vs NA on a dual-axis live chart; EUV vs DUV comparison table showing required k1, DOF ratio, and multi-patterning passes for any target CD
- Oxidation: Deal-Grove oxide thickness vs time with a full 800–1200 °C family of curves; current temperature highlighted; regime indicator (linear / mixed / parabolic); live rate constants B/A and B
- Implantation: Gaussian concentration profile on a log-scale chart with background doping line; real-time Rp, dRp, peak concentration, and junction depth from SRIM range data for B, P, As, BF2
- Yield: Murphy and Poisson yield curves vs defect density D0 for the current die geometry; dies per wafer and good dies per wafer updated instantly; 200 mm and 300 mm wafer support
- All charts powered by Chart.js with a dark semiconductor-tool aesthetic; sub-100 ms animation on every slider move
Web agent — Claude tool use
- Ask process questions in plain language; the agent picks the right model, runs the calculation, and explains the physics
- Streamlit sidebar provides standalone interactive plots (resolution vs NA, implant profiles) without an API key
- 16 unit tests covering all four calculation modules — no API key required
cd desktop
npm install
npm start
Sliders and radio buttons update every chart in real time — no submit button.
| Control | Effect |
|---|---|
| Wavelength toggle (EUV / DUV) | Switches between 13.5 nm and 193 nm; NA slider clamps to physical maximum |
| NA slider | Moves the highlighted operating point on the resolution / DOF chart |
| k1 / k2 sliders | Adjusts process factors; resolution and DOF update instantly |
| Temperature slider | Highlights the nearest curve in the oxidation family; recalculates rate constants |
| Time slider | Moves the thickness result; chart time axis scales to context |
| Species / Energy / Dose | Regenerates the full Gaussian profile and recalculates junction depth |
| D0 / Die size / Wafer | Redraws the yield curve; good-die count updates in the results card |
Build a signed NSIS installer:
npm run build
Output lands in desktop/dist/. Auto-update polls releases/latest on each launch and installs silently on quit.
pip install -r requirements.txt
export ANTHROPIC_API_KEY=sk-ant-...
streamlit run app.py
Example questions:
- What resolution can EUV reach at NA = 0.33?
- How long to grow 8 nm dry SiO2 at 900 °C on Si(100)?
- Compare EUV and DUV ArF immersion for a 7 nm half-pitch.
- Junction depth for boron at 1×10¹⁴ cm⁻², 80 keV, into a 10¹⁷ cm⁻³ p-well?
- Murphy yield for D0 = 0.5 cm⁻² on a 100 mm² die, 300 mm wafer?
- Given these overlay measurements, is the process within ±3 nm spec?
Run tests (no API key needed):
pytest tests/ -v
litho-agent/
├── agent/
│ ├── core.py Claude tool-use loop — agent layer
│ └── tools/
│ ├── lithography.py Rayleigh, DOF, EUV vs DUV, overlay budget
│ ├── oxidation.py Deal-Grove model — dry + wet, Si(100) + Si(111)
│ ├── implantation.py Gaussian profiles, junction depth, sheet resistance
│ └── yield_model.py Poisson, Murphy, SPC, Cpk, fab economics
├── desktop/
│ ├── package.json Electron + electron-builder config; auto-update wired to this repo
│ ├── build/icon.ico Installer icon
│ └── src/
│ ├── main.js Electron main process — window, updater
│ ├── preload.js Context bridge
│ ├── index.html App shell — four-panel layout
│ ├── renderer.js All physics models + Chart.js charts
│ └── styles.css Dark semiconductor-tool theme
├── tests/
│ └── test_tools.py 16 unit tests — Lithography, Oxidation, Implantation, Yield
├── app.py Streamlit chat interface
└── requirements.txt
| Model | Reference |
|---|---|
| Rayleigh resolution / DOF | Born & Wolf, Principles of Optics; ASML NXE product specs |
| Thermal oxidation | B.E. Deal & A.S. Grove, J. Appl. Phys. 36, 3770 (1965) |
| Implant ranges | Ziegler, SRIM-2013; Jaeger, Introduction to Microelectronic Fabrication, Table 3.1 |
| Yield — Murphy | W.J. Murphy, Proc. IEEE 52, 1537 (1964) |
| Yield — Poisson | Standard Poisson defect distribution |
| SPC / Cpk | Montgomery, Introduction to Statistical Quality Control |
Models reproduce textbook results and are suitable for first-order process planning and education. They are intentionally simplified relative to production TCAD tools such as Sentaurus or Athena.
MIT